BSN 2022 Call for Papers
The IEEE-EMBS International Conference on Biomedical and Health Informatics (BHI) and the IEEE International Conference on Wearable and Implantable Body Sensor Networks (BSN) are sponsored by the IEEE Engineering in Medicine and Biology Society (IEEE-EMBS) on informatics and computing in healthcare and life sciences. IEEE-EMBS BHI 2022 will be co-organized with IEEE-EMBS BSN 2022 and will take place in Ioannina, Greece, from 27-30 September, 2022. It will provide a unique forum to showcase enabling technologies of devices and sensors, hardware and software systems, predictive models, databases, and big data analytics and machine learning that optimize the acquisition, transmission, processing, monitoring, storage, retrieval, analysis, visualization and interpretation of vast volumes of multi-modal biomedical data, as well as related social, behavior, environmental, and geographical data. Authors are invited to submit full papers (4 Pages) and demo/poster abstracts (1 Page) presenting cutting-edge research related to the theory and/or practice of wearable, ingestible and implantable sensors and systems in the healthcare/medical domains. Areas of interest include, but are not limited to:
» Prototyping of body-worn, ingestible and implantable sensor networks
» Novel chemical, biological and textile body sensors
» Flexible and/or stretchable electronic sensors and systems
» Ultra-low-power or battery-less solutions for longitudinal studies
» Machine learning, deep learning and decision support algorithms
» Body area communication protocols, models and theories
» Security, privacy and trust in body sensor network; and Medical/wellness applications from pre-natal health to elderly care
Conference Co-Chairs
Canan Dagdeviren, canand@media.mit.edu, Massachusetts Institute of Technology, USA
Emil Jovanov, emil.jovanov@uah.edu, University of Alabama, USA
Paolo Bonato, pbonato@mgh.harvard.edu, Harvard Medical School, USA
Program Co-Chairs
Benny Lo, benny.lo@imperial.ac.uk, Imperial College London, Europe
Oliver Amft, oliver.amft@fau.de, Friedrich-Alexander-Universität Erlangen-Nürnberg, Europe
Rita Paradiso, rita@smartex.it, Smartex s.r.l., Europe
Special Session Co-Chairs
Christina Chase, cchase@mit.edu, Massachusetts Institute of Technology, USA
Giancarlo Fortino, g.fortino@unical.it, University of Calabria, Europe
Wei Chen, w_chen@fudan.edu.cn, Fudan University, Asia
Industry Liaison
Paul Wacnik, Paul.Wacnik@pfizer.com, Pfizer, USA
Valeria De Luca, valeria.de_luca@novartis.com, Novartis, Europe
Roozbeh Ghaffari, rooz@northwestern.edu, Epicore Biosystems and Northwestern University, USA
Rapid Fire Session Co-Chairs
Katarzyna Wac, Katarzyna.Wac@unige.ch, University of Geneva, Europe
Shyamal Patel, shyamal.patel@gmail.com, Oura, USA
Sunghoon Ivan Lee, silee@cs.umass.edu, University of Massachusetts Amherst, USA
Technical Program Committee Members
Salzitsa Anastasova-Ivanova, s.anastasova-ivanova@imperial.ac.uk, Imperial College London, Europe
Stacy Bamberg, stacy@veristride.com, Veristride, USA
Riccardo Barbieri, rbarbieri120@gmail.com, Politecnico di Milano, Europe
Walter Besio, besio@uri.edu, Univ of Rhode Island, USA
Dinesh Bhatia, dinesh@utdallas.edu, The University of Texas at Dallas, USA
Brian Caufield, b.caulfield@ucd.ie, University College Dublin, Europe
Ieuan Clay, ieuan.clay@vivosense.com, VivoSense, USA
Andrew DeHennis, adehennis@gmail.com, Senseonics Inc, USA
Danilo Demarchi, danilo.demarchi@polito.it, Politecnico di Torino, Italy
Lei Ding, leiding@ou.edu, University of Oklahoma, USA
Kelley Erb, kelley.erb@gmail.com, Biogen Inc, USA
Björn Eskofier, bjoern.eskofier@fau.de, Friedrich-Alexander-Universität Erlangen-Nürnberg, Europe
Hassan Ghasemzadeh, hassan.ghasemzadeh@wsu.edu, Washington State University, USA
Balaji Goparaju, balaji.goparaju@novartis.com, Novartis, Europe
Perena Gouma, gouma.2@osu.edu, Ohio State Univ, USA
Raffaele Gravina, r.gravina@dimes.unical.it, University of Calabria, Europe
Mohammad Mehedi Hassan, mmhassan@ksu.edu.sa, King Saud University, Middle East
Roozbeh Jafari, rjafari@tamu.edu, Texas A&M University, USA
Christopher J. James, C.James@warwick.ac.uk, University of Warwick, Europe
Christoph Kanzler, kanzchri47@googlemail.com, ETH-Singapore, Asia
Aimé Lay-Ekuakille, aime.lay.ekuakille@unisalento.it, Univ of Salento, Europe
Steffen Leonhardt, leonhardt@hia.rwth-aachen.de, RWTH Aachen University, Europe
Ye Li, ye.li@siat.ac.cn, Shenzhen Institutes of Advanced Technology, Asia
Wen Li, wenli@egr.msu.edu, Michigan State University, USA
Jie Liang, jliang@uic.edu, University of Illinois Chicago, USA
Qing Liu, Qing.Liu@xjtlu.edu.cn, Xi’an Jiaotong-Liverpool University, Asia
Luca Mainardi, luca.mainardi@polimi.it, Politecnico di Milano, Europe
Fernando Seoane Martinez, fernando.seoane_martinez@hb.se, University of Borås, Europe
Ryan McGinnis , ryan.mcginnis@uvm.edu, University of Vermont, USA
Carolyn McGregor, c.mcgregor@ieee.org, University of Ontario, Canada
Bobak Mortazavi, bobakm@tamu.edu, Texas A&M University, USA
Gabriella Olmo, gabriella.olmo@polito.it, Politecnico di Torino, Italy
Joe Paradiso, joep@media.mit.edu, Massachusetts Institute of Technology, USA
Federico Parisi, fparisi@partners.org, Harvard Medical School, USA
Edward Park, ed_park@sfu.ca, Simon Fraser University, Canada
Julien Penders, julien@bloom-life.com, Bloomlife Inc, USA
Octavian Postolache, opostolache@lx.it.pt, Universidade de Lisboa, Europe
Hongliang Ren, ren@nus.edu.sg, National University of Singapore, Singapore
Bruno Miguel Gil Rosa, b.gil-rosa@imperial.ac.uk, Imperial College London, Europe
Edward Sazonov, esazonov@ieee.org, University of Alabama, USA
Vrutangkumar Shah, shahvr@ohsu.edu, Oregon Health & Science University, USA
Peter Shull, peter@sagemotion.com, Sage Motion, Asia
Ye (Sarah) Sun, dzv7sg@virginia.edu, University of Virginia, USA
Toshiyo Tamura, t.tamura1949@gmail.com, Waseda University, Asia
Brian A. Telfer, telfer@ll.mit.edu, MIT Lincoln Laboratory, USA
Ashkan Vaziri, ashkan.vaziri@biosensics.com, BioSensics LLC, USA
Eric Yeatman, e.yeatman@imperial.ac.uk, Imperial College London, Europe
Hong Yeo, woonhong.yeo@me.gatech.edu, Georgia Institute of Technology, USA
Yali Zheng, zhengyali@sztu.edu.cn, The Chinese University of Hong Kong, Asia
Wenchuan Wei, w8wei@eng.ucsd.edu, Samsung Research America, USA
Submission Deadline for SS and Workshop Proposals – May 15, 2022
Acceptance notification of SS and Workshop Proposals – May 22, 2022
Regular Full-Length Paper Submission Deadlines – May 30, 2022 NEW EXTENSION to June 30, 2022
Submission Deadline of Special Session Papers (4 and 1 page) – June 15, 2022 NEW EXTENSION to June 30, 2022
Acceptance Notification of Full-Length and SS Papers – July 15, 2022
Initial Regular 1-Page Paper Submission Deadlines – July 27th, 2022 NEW EXTENSION to August 5, 2022
Acceptance Notification of 1-Page Extended Abstracts – Aug 5th, 2022
Submission Deadline of Camera-Ready Papers and Extended Abstracts – August 15, 2022
